Xijianda develops high-performance epoxy material for power semiconductors
On October 31, 2025, Xi'an University of Architecture and Technology (Xijianda) announced a breakthrough in power semiconductor packaging materials. The university's New Energy Electrical Materials and Energy Storage Technology team introduced a novel epoxy encapsulation compound that combines ultra-high thermal conductivity with excellent insulation properties. This material is designed to operate reliably at temperatures up to 200°C (392°F), addressing key challenges in high-power electronics.
The research, published in Advanced Functional Materials, presents a molecularly ordered design strategy that enhances both heat dissipation and electrical insulation. The team used organic molecules as templates to guide the epoxy resin into a highly ordered structure. This configuration creates efficient thermal pathways while tightly packing molecules to trap high-energy electrons, maintaining insulation even under extreme heat.
Power semiconductor devices-often referred to as the "brains" of electric motors and smart grid systems-are becoming smaller and more powerful. However, this evolution intensifies the conflict between thermal management and electrical safety. Experts note that current packaging materials are a bottleneck, with many high-end solutions still reliant on imports. The market urgently needs materials that offer both high thermal conductivity and strong insulation.
Xijianda's new compound addresses this need by eliminating the trade-off between heat dissipation and insulation. According to Associate Professor Wang Zhengdong, "We achieved a leap in macroscopic performance through minimal molecular design, allowing packaging materials to deliver both thermal and electrical advantages." The innovation could lead to thinner, more reliable power electronics for electric vehicles, renewable energy systems, and industrial automation.
Xi'an University of Architecture and Technology (Xijianda) is a leading research institution in western China. Its engineering faculty is known for pioneering work in materials science, particularly in energy systems and semiconductor technologies.
